WATERLOO, Canada – February 21, 2017 - Teledyne DALSA, a Teledyne Technologies company and one of the world’s foremost pure-play MEMS foundries has signed a technology transfer and license agreement for Direct Bond Interconnect (DBI®) technology with Invensas Corporation, a wholly owned subsidiary of Tessera Holding Corporation (Nasdaq: TSRA). This agreement enables Teledyne DALSA to leverage Invensas’ semiconductor wafer bonding and 3D interconnect technologies to deliver next-generation MEMS and image sensor solutions to customers in the automotive, IoT, and consumer electronics markets.
“DBI technology is a key enabler for true 3D-integrated MEMS and image sensor solutions,” said Edwin Roks, president of Teledyne DALSA. “We are excited about the prospect of developing new products and providing new foundry services to our customers that utilize this technology. By working closely with Invensas, we will be able to move more quickly to deploy this capability efficiently and effectively.”
DBI technology is a low temperature hybrid wafer bonding solution that allows wafers to be bonded instantaneously with exceptionally fine pitch 3D electrical interconnect without requiring bond pressure. The technology is applicable to a wide range of semiconductor devices including MEMS, image sensors, RF Front Ends and stacked memory.
“We are pleased that Teledyne DALSA, a recognized leader in digital imaging products and MEMS solutions, has chosen our DBI technology to accelerate the development and commercialization of their next generation MEMS and image sensor products,” said Craig Mitchell, president of Invensas. “As device makers look for increasingly powerful semiconductor solutions in smaller packages, the need for cost-efficient, versatile 3D technologies is greater than ever before. We are confident that the superior performance and manufacturability of DBI technology will help Teledyne DALSA deliver tremendous value to their customers.”
Tessera Holding Corporation is the parent company of DTS, FotoNation, Invensas and Tessera. We are one of the world’s leading product and technology licensing companies. Our technologies and intellectual property are deployed in areas such as premium audio, computational imaging, computer vision, mobile computing and communications, memory, data storage, 3D semiconductor interconnect and packaging. We invent smart sight and sound technologies that enhance and help to transform the human connected experience.
Teledyne DALSA is an international technology leader in sensing, imaging, and specialized semiconductor fabrication. Our image sensing solutions span the spectrum from infrared through visible to X-ray; our MEMS foundry has earned a world-leading reputation. In addition, through our subsidiaries Teledyne Optech and Teledyne Caris, we deliver advanced 3D survey and geospatial information systems. Teledyne DALSA employs approximately 1,400 employees worldwide and is headquartered in Waterloo, Canada. For more information, visit www.teledynedalsa.com.
All trademarks are registered by their respective companies.
Teledyne DALSA reserves the right to make changes at any time without notice.