Teledyne DALSA displays its high value imaging at China’s Electronic Equipment Industry ExpositionExpo 2017
Shenzhen, China – July 20, 2017 - Teledyne DALSA, a Teledyne Technologies company and global leader in image sensing technology, will demonstrate its high value capabilities with “live” in-booth demonstrations at the 6th China Electronic Equipment Industry Exposition, in Hall 9, Stand 9E17-1, taking place July 27-29 at Shenzhen Convention and Exhibition Center
The following are featured:
- Piranha™ XL color CMOS TDI line scan cameras provide an unprecedented combination of speed, resolution, and responsivity with low noise color imaging. New 8 and 16k models deliver high sensitivity using 4 rows per RGB channel for 12 rows in total and employ the industry’s most advanced CMOS sensor architecture, achieving data throughput of up to 5 Gbytes/second on a single CX4 cable.
- The new Linea™ monochrome line scan camera employs a 16k single line 3.5 µm x 3.5 µm pixel array at a 71 kHz maximum line rate with a Camera Link™ HS interface. Compact and light-weight, this latest model features flat-field correction, multiple ROI and AOI, multiple user configuration sets, and calibration coefficients for various lighting conditions.
- Genie™ Nano cameras feature the industry’s most powerful color and monochrome image sensors. With more than 40 models to choose from, low-cost Nano models are available in resolutions from VGA to 25 Mpixels, with a GigE Vision™ or Camera Link interface and serve applications that include intelligent transport systems (ITS), food and printed circuit board (PCB) inspection.
- BOA™ Spot vision sensors combine the power and flexibility of a vision system with integrated LED lighting, lens cover, and easy-to-use software. Fast and robust, these new vision sensors can decode 1D barcodes with bar widths and spacing down to 1.5 pixels; and 2D matrix codes with cell or dot sizes down to 2 pixels. Simple, affordable and reliable inspection for a range of error-proofing applications.
Teledyne DALSA is located in booth 9E17-1, Hall 9. Stop by, meet the team and learn more about the industry’s most advanced imaging technologies.
Shenzen Convention and Exhibition Center
Stand 9E17-1, Hall 9
July 27-29, 2017
About Teledyne DALSA
Teledyne DALSA is an international technology leader in sensing, imaging, and specialized semiconductor fabrication. Our image sensing solutions span the spectrum from infrared through visible to X-Ray; our MEMS foundry has earned a world-leading reputation. In addition, through our subsidiaries Teledyne Optech and Teledyne Caris, we deliver advanced 3D survey and geospatial information systems. Teledyne DALSA employs approximately 1400 employees worldwide and is headquartered in Waterloo, Canada. For more information, visit www.teledynedalsa.com.
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Teledyne DALSA reserves the right to make changes at any time without notice.
Teledyne DALSA, China
Tel: +86 21 64279081