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Custom Solutions

Minor tweaks to major engineering

Experience

Teledyne DALSA is uniquely positioned to offer innovative custom solutions to exceed your next generation requirements. With a technology portfolio covering wavelengths from X-ray to infrared, Teledyne DALSA Custom Solutions delivers solutions tuned to your most challenging applications.

  • Optimize performance for your applications
  • Differentiate your solutions with unique features
  • Integrate functionality for competitive advantage
  • Reduce your time to market by leveraging our technology portfolio

Capabilities

  • Decades of proven design, engineering and manufacturing expertise
  • World-leading CMOS and CCD image sensors and cameras
  • Vision modules and subsystems
  • Specialized illumination
  • Optics
  • Embedded processing
  • Data acquisition
  • Image processing hardware and software
  • Testing, packaging

Applications

Astronomy Astronomy Earth Observation Earth Observation Ophthalmology Ophthalmology Spectroscopy Spectroscopy
Aerospace Aerospace Industrial Industrial Recreation Recreation Wafer Inspection Wafer Inspection
Defense & Security Defense & Security Motion Capture Motion Capture Remote Sensing Remote Sensing X-Ray X-Ray

Custom Image Sensors

Custom Image Sensors

Custom Cameras

Custom Cameras

Custom Sensor Capabilities

Teledyne DALSA's history in solid state imaging reaches back to 1969, when founder Dr. Savvas Chamberlain, one of the pioneers of CCD and CMOS image sensors, began his research. He founded the company to commercialize his work. Today Teledyne DALSA offers world-leading products in CMOS and CCDs with a wide range of advanced capabilities.

Capabilities

  • CMOS and CCD design
  • NIR and IR sensors, including Microbolometers
  • Color and multispectral filters
  • Spectrum coverage from X-ray through deep UV, visible, NIR, SWIR, MWIR, and LWIR
  • Backside thinning
  • Radiation tolerance
  • Ultra high speed (100 Mpfs)
  • Ultra high resolution (100+ megapixels)

 

  • Wafer scale devices
  • Custom window attachment and sensor packaging for challenging environments
  • Fiber optic attachments
  • Extended environmental testing, including basic MIL-STD
  • Backside Thinning for high sensitivity and QE
  • Radiation Hardness
  • Multispectral Filters

Example Completed Designs

 

Six-tile x-ray panel, 30 cm x 24 cm

50 megapixel

2 Gpix/sec backside thinned TDI

100 million fps

Radiation hard TDI

 

 

 

 

 

100 megapixel

86 megapixel CMOS

X-Ray TDI

Board-level packaging

70% QE, FSI

 

 

 

 

 

Multispectral TDI

High-speed CMOS

CMOS linescan

Wafer-scale CCD

Wafer-scale CMOS

More Sensor Capabilities

Teledyne DALSA is part of the Teledyne Imaging Group, and our sister companies offer related and complementary sensor capabilities:

  • Teledyne e2v: CCD and CMOS image sensors for applications from machine vision to astronomy
  • Teledyne AnaFocus: Custom 2D and 3D CMOS image sensors
  • Teledyne Imaging Sensors: Cooled (HgCdTe) focal plane arrays in NIR, MWIR, and LWIR for scientific and astronomy applications
  • Teledyne Judson: Two dimensional infrared focal plane arrays (InGaAs, InSb, and MCT) and Integrated Dewar Cooler Assemblies (IDCAs) for scientific and security applications

Custom Camera Capabilities

Teledyne DALSA is uniquely positioned to offer innovative custom solutions to exceed your next generation requirements. With design and manufacturing expertise and engineering services spanning sensors, cameras, vision modules, specialized illumination, optics, data acquisition, and image processing, Teledyne DALSA Custom Solutions delivers vision solutions tuned to your most challenging applications.

Time to market is critical, and Teledyne DALSA has the tools in place to fast track challenging product developments. Customers will benefit from dedicated project teams focused on leading edge design, build, and manufacturing processes as well as a highly trained technical support team to assist with product test and integration.

Custom camera architecture examples

  • 1000-output TDI cameras with 4 Gigapixel/sec throughput
  • 12-bit dynamic range at 1.2 Gpix/sec
  • Ultra-high speed with on-chip multi-frame storage, 100,000,000fps burst rate
  • Remote head, stackable and single board camera designs
  • High speed serialized data interfaces up to 10Gb/sec
  • Cooling options for low noise and long exposures

Imaging modules and subsystems

  • Custom illumination and optics
  • Image processing and classification
  • Scalable architecture for growth in capacity
  • Data reduction (2.56 Gbytes/sec in single framegrabber) for massively parallel systems

Customized Manufacturing Capabilities

From silicon to cameras, Teledyne DALSA's manufacturing capabilities include:

  • Color CCD manufacturing
  • Custom window attachment and sensor packaging for challenging environments
  • Backside thinning
  • Radiation tolerance
  • Fiber optic attachments
  • Extended environmental testing, including basic MIL-STD

Example Completed Designs

Electron detection TDI

DUV TDI

DUV linescan, 1MHz line rate

High volume TDI for FPD inspection

100 million fps, MIL-STD compliant

  

Learn more

Questions? Need more info? Contact our sales team about our custom capabilities today.

Contact Sales