Teledyne DALSA Semiconductor’s Advanced MEMS Prototyping and Production Featured at EU MEMS & Sensors Summit 2017
As one of the world’s foremost pure-play MEMS foundries, Teledyne DALSA Semiconductor offers advanced MEMS technologies and high-volume manufacturing on both 150 and 200 mm wafers, delivering a complete solution from prototype to mass production. A comprehensive MEMS toolbox allows the development and mass production of a wide range of sensors and actuators, including micro-mirrors, micro-bolometers, pressure sensors, microphones, inertial sensors, micro-fluidics, and oscillators. Many of the device types manufactured by Teledyne DALSA include wafer-level packaging or through-silicon-via (TSV) technology, which enables advanced packaging solutions and opens new markets for MEMS.
The Summit takes place September 20-22, at the MINATEC Conference Center in Grenoble, France.
Where: European MEMS & Sensors Summit 2017, Booth #30
MINATEC Conference Center, Grenoble, France
When: Wednesday, September 20 – Friday, September 22
About Teledyne DALSA Semiconductor
Located in Bromont, Quebec, Canada, Teledyne DALSA's pure-play semiconductor wafer foundry has a history of flexibility and innovation for MEMS, MOEMS and silicon-based micro machining. As a manufacturing partner to fabless and fab-lite semiconductor companies, the foundry helps customers succeed with their advanced MEMS designs. Visit www.teledynedalsa.com/semi
for more information.
About Teledyne DALSA
Teledyne DALSA is an international technology leader in sensing, imaging, and specialized semiconductor fabrication. Our image sensing solutions span the spectrum from infrared through visible to X-ray; our MEMS foundry has earned a world-leading reputation. In addition, through our subsidiaries Teledyne Optech and Teledyne Caris, we deliver advanced 3D survey and geospatial information systems. Teledyne DALSA employs approximately 1400 employees worldwide and is headquartered in Waterloo, Canada. For more information, visit www.teledynedalsa.com
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